波野吉多结衣在线观看_国产精品人人爽人人做我的可爱_严洲国产av精品一区二区三区_欧美xxxx黑人又粗又长_一本无码人妻在中文字幕免费_久久久久久亚洲精品不卡_成年的人不懂如何谈恋爱_欧洲无线一线二线三w955_免费观看同性男男gv片

Multifunctional BGA Rework: Solutions
Industry background

As technology advances, electronic products play an increasingly important role in our lives, from smartphones and computers to smart devices. These rely on advanced electronics manufacturing techniques. The scale and technical level of the electronics manufacturing industry continue to grow, with BGA packaging technology becoming widely used due to its high density and performance, seen in computer motherboards and smartphone chips.


Challenges and Demands in the Industry
BGA packaging technology connects circuits using solder balls arranged at the chip\'s bottom. Its advantages include high density, performance, and reliability, making it essential in electronics manufacturing. However, as its usage increases, so does the likelihood of BGA chip failures, requiring advanced rework equipment.
KAIYUN technology solutions
Seamark ZM provides intelligent BGA rework equipment, automated solder removal devices, automated ball placing machines, and laser welding equipment. These solutions cater to semiconductors, electronics manufacturing, communication equipment, and computer hardware. Seamark ZM holds a leading market share in BGA chip soldering and rework equipment.
Advantages of KAIYUN Technology
Precise visual alignment
Multifunctional control features
Precision motion platform
Independent three-zone editing
Stable temperature control
Lower heating system
Related products
contact us
If you have any questions, please contact us!
Learn More
About Us
Learn about Zhuo MAO
Learn More